CU1124 by Beckhoff

The Beckhoff CU1124 copper busbar delivers robust power distribution in the CU EtherCAT Junctions series, offering exceptional electrical conductivity and reliable current handling for demanding industrial automation environments. Manufactured from high-purity copper, the CU1124 provides a compact solution for power bridging and busbar assemblies, with a precise length-to-thickness ratio tailored to modular junction designs. With a current rating of 315 A, this component supports substantial load currents typically found in control cabinets, drive systems, and power distribution blocks. Its bare finish and uninsulated configuration simplify integration into grounded busbar frameworks, ensuring minimal voltage drop and efficient heat dissipation across the entire conductive path. The CU1124’s streamlined geometry and consistent material properties enable stable performance under repetitive load cycles and vibration common to industrial machinery.

In-depth technical specifications highlight the CU1124’s engineered dimensions and mounting provisions. The busbar measures 300 mm in length, 20 mm in width, and 5 mm in thickness, providing a low-resistance conductive cross section for high-current applications. The copper busbar weighs 0.75 kg, balancing mechanical stability with ease of installation. Its bare finish promotes direct metal-to-metal contact, eliminating the need for secondary conductive coatings. As an uninsulated component with insulation none (uninsulated), the CU1124 relies on system-level insulation strategies to manage dielectric clearances. Mounting is facilitated by four mounting holes, each featuring a diameter of 8.5 mm, enabling secure fastening to chassis or busbar supports. Classified as a copper busbar type, this part is explicitly designed for modular junction assemblies in complex power distribution networks.

Operational performance of the CU1124 extends across harsh industrial climates, with an operating temperature range of -40 degrees C to +105 degrees C. This broad thermal tolerance ensures uninterrupted conductivity in both subzero ambient conditions and elevated temperature zones adjacent to heat-generating power electronics. The omission of insulation reduces thermal resistance, allowing the copper mass to dissipate heat efficiently and maintain stable electrical characteristics over extended duty cycles. The precise hole pattern and dimensional tolerances guarantee consistent alignment with standardized mounting rails and junction modules. Its solid-copper construction resists fatigue under mechanical vibration and thermal cycling, delivering sustained reliability in applications from automated assembly lines to mobile machinery platforms.

System integration is simplified by the CU1124’s compatibility with Beckhoff’s EtherCAT Junction components and industrial automation architectures. The CU EtherCAT Junctions series accommodates multiple busbar segments, and the CU1124 serves as a fundamental conductive link within these networks. Target applications include control cabinet power distribution, drive system busbar assemblies, and centralized grounding networks in factory automation. Engineers specifying the CU1124 benefit from its predictable electrical performance, modular mounting options, and broad environmental ratings, making it an ideal choice for rigorous industrial power management tasks.